Journal: Clinical and Experimental Dental Research

Article Title: The micro‐shear bond strength of resin cements to aged laser bleached enamel after using different desensitizing agents

doi: 10.1002/cre2.496

Figure Lengend Snippet: Materials used in the study

Article Snippet: The specimens were etched with 37% phosphoric acid etching gel for 15 s (Pentron Clinical, Orange, CA, batch no. 671065) then were rinsed and dried for the same length of time, leaving the enamel visibly moist.

Techniques: Titanium Dioxide, Guar Gum

Journal: ACS Omega

Article Title: Effects of Phosphoric Acid Pre-Etching on Chemisorption between Enamel and MDP-Containing Universal Adhesives: Chemical and Morphological Characterization, and Evaluation of Its Potential

doi: 10.1021/acsomega.1c01016

Figure Lengend Snippet: SEM images of enamel surfaces after (A) phosphoric acid etching and (B) conditioned by Single Bond Universal, (C) All Bond Universal, (D) Clearfil Universal Bond Quick, and (E) EX with prior phosphoric acid etching.

Article Snippet: Applications of the universal adhesives on the enamel surface were performed according to the corresponding manufacturer in either an SE or an ER mode by etching with a phosphoric acid gel (35%, Bisco, Schaumburg, IL) for 15 s. The composition of the adhesives and their application are shown in Tables and .

Techniques:

Journal: ACS Omega

Article Title: Effects of Phosphoric Acid Pre-Etching on Chemisorption between Enamel and MDP-Containing Universal Adhesives: Chemical and Morphological Characterization, and Evaluation of Its Potential

doi: 10.1021/acsomega.1c01016

Figure Lengend Snippet: FTIR spectra of the untreated enamel (UE), enamel surfaces conditioned with Clearfil SE Bond primer (CSE-SE), Single Bond Universal (SBU-SE), All Bond Universal (ABU-SE), Clearfil Universal Bond Quick (CBQ-SE), and EX (EX-SE) in a self-etch mode (A); enamel surfaces after phosphoric acid etching (Etch) and conditioned by Single Bond Universal (SBU-ER), All Bond Universal (ABU-ER), Clearfil Universal Bond Quick (CBQ-ER), and EX (EX-ER) with prior phosphoric acid etching (B). Peaks at 1718 cm –1 represent the band of C=O stretching vibration of acrylate or methacrylate groups. Arrows indicate the emergence of new phosphate peaks following treatment of enamel with the respective adhesives.

Article Snippet: Applications of the universal adhesives on the enamel surface were performed according to the corresponding manufacturer in either an SE or an ER mode by etching with a phosphoric acid gel (35%, Bisco, Schaumburg, IL) for 15 s. The composition of the adhesives and their application are shown in Tables and .

Techniques:

Journal: ACS Omega

Article Title: Effects of Phosphoric Acid Pre-Etching on Chemisorption between Enamel and MDP-Containing Universal Adhesives: Chemical and Morphological Characterization, and Evaluation of Its Potential

doi: 10.1021/acsomega.1c01016

Figure Lengend Snippet: Wide-scan XPS spectra of enamel surfaces after phosphoric acid etching (Etch), conditioned by Single Bond Universal (SBU-ER), All Bond Universal (ABU-ER), Clearfil Universal Bond Quick (CBQ-ER), and EX (EX-ER) with prior phosphoric acid etching. The etched enamel surfaces treated with the four MDP-containing adhesives show a significantly increased C 1s peak intensities compared with those of the Etch group.

Article Snippet: Applications of the universal adhesives on the enamel surface were performed according to the corresponding manufacturer in either an SE or an ER mode by etching with a phosphoric acid gel (35%, Bisco, Schaumburg, IL) for 15 s. The composition of the adhesives and their application are shown in Tables and .

Techniques:

Journal: ACS Omega

Article Title: Effects of Phosphoric Acid Pre-Etching on Chemisorption between Enamel and MDP-Containing Universal Adhesives: Chemical and Morphological Characterization, and Evaluation of Its Potential

doi: 10.1021/acsomega.1c01016

Figure Lengend Snippet: Narrow-scan C 1s XPS spectra of the C 1s region of the etched enamel surface (Etch) revealing: the peak at 284.4 eV representing backbone (C–C, C–H, and C=C) bindings, the peak at 285.8 eV representing C–O binding, and the peak at 288.1 eV representing the C=O binding. Enamels treated with Single Bond Universal (SBU-ER), All Bond Universal (ABU-ER), Clearfil Universal Bond Quick (CBQ-ER), and EX (EX-ER) with prior phosphoric acid etching show similar peaks around 284.5 eV (backbone C–C, C–H, and C=C bindings), 285.4 eV (C–O binding), and 288.6 eV (−COO– binding).

Article Snippet: Applications of the universal adhesives on the enamel surface were performed according to the corresponding manufacturer in either an SE or an ER mode by etching with a phosphoric acid gel (35%, Bisco, Schaumburg, IL) for 15 s. The composition of the adhesives and their application are shown in Tables and .

Techniques: Binding Assay

Journal: ACS Omega

Article Title: Effects of Phosphoric Acid Pre-Etching on Chemisorption between Enamel and MDP-Containing Universal Adhesives: Chemical and Morphological Characterization, and Evaluation of Its Potential

doi: 10.1021/acsomega.1c01016

Figure Lengend Snippet: Application Protocols According to the Manufacturer’s Instructions

Article Snippet: Applications of the universal adhesives on the enamel surface were performed according to the corresponding manufacturer in either an SE or an ER mode by etching with a phosphoric acid gel (35%, Bisco, Schaumburg, IL) for 15 s. The composition of the adhesives and their application are shown in Tables and .

Techniques: